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Chiplets, Capacity, and Competition

Published on June 26


This week’s semiconductor roundup highlights the industry’s shift toward more modular, secure, and AI optimized architectures. SEALSQ’s partnership with Quantum Leap Lab signals growing urgency around embedding quantum resistant cryptography directly into chips, especially for edge and automotive applications. Meanwhile, a major piece from SemiEngineering outlines the rising adoption of chiplet based SoC designs, enabling greater design flexibility, reuse, and security, but also introducing complexity in packaging, interconnect, and trust boundaries across multi-die systems.

On the manufacturing front, SEMI forecasts a 70% jump in advanced node capacity by 2028, fueled primarily by AI workloads and high-performance computing, a clear signal that global fabs are realigning investments around data driven applications. In Asia, Intel Foundry Services is actively courting Samsung clients in Korea, promoting its U.S. based packaging capabilities and geopolitical stability. Together, these stories illustrate a broader trend: the convergence of security, modularity, and foundry geopolitics is rapidly reshaping how and where the next generation of chips will be designed and built.


🔐 Quantum Leap, SEALSQ Lab to develop innovation for semiconductor industry

SEALSQ and Quantum Leap Lab are collaborating on post-quantum cryptography to harden chip security in sectors like automotive and industrial IoT. Their work targets embedding quantum resistant algorithms directly into semiconductor designs.

📈 SEMI forecasts growth in advanced chipmaking capacity through 2028 due to AI

SEMI projects a 70% increase in sub 5nm capacity by 2028, driven by AI and data infrastructure needs. The U.S., Taiwan, and Korea will lead this investment wave in next gen node scaling.

🧩 Redefining SoC Design: The Shift To Secure Chiplet-Based Architectures

Chiplet based architectures are gaining ground as a flexible, secure alternative to monolithic SoCs. This design shift enables faster iteration and modularity, but raises challenges in packaging and interconnect security.

🇰🇷 Intel Hosts Direct Connect Asia Event in Seoul, Company Tries to Lure Samsung Foundry Clients in Its Own Backyard

At its Seoul event, Intel pitched its U.S. based foundry services to potential Samsung clients, promoting advanced packaging and geopolitical stability as key differentiators in a crowded foundry market.