TSMC’s decision to start accepting 2nm wafer orders in April 2025 marks a turning point in chip manufacturing. At around $30,000 per wafer, this next generation process is not just about improved performance, it's also raising the bar on cost and complexity. Apple plans to use the 2nm process in its A20 chips for the iPhone 18 Pro models, and Qualcomm and MediaTek are expected to follow suit. As TurtlesAI and Gadgets360 report, this could push smartphone prices even higher.

TSMC’s financial pressure is mounting. According to TrendForce, the company’s Arizona fab posted a NT$14.3 billion loss in 2024 (roughly 440 million USD), its largest overseas, and is raising US 4nm chip prices by as much as 30 percent to offset these rising costs.

For engineers working in or entering the semiconductor field, the industry is doubling down on talent that can get the most out of expensive wafers and advanced nodes. Roles in physical design, power and thermal optimization, and architecture will be in high demand. At the same time, teams focused on legacy nodes or generalist functions may see slower growth. As TSMC builds out its global footprint, with more advanced fabs underway in Arizona, Japan, and Europe, the pressure to deliver high margin, high efficiency chips is only going to increase. The message for engineers is simple: the future favors those who can push the limits of what silicon can do, and do it cost effectively.