Texas Instruments has announced a landmark $60 billion investment to build and expand seven semiconductor fabs across Texas and Utah, a move that underscores the industry's strategic shift toward domestic manufacturing and supply chain resilience. With four new fabs planned for Sherman, TX, and additional capacity ramping in Richardson and Lehi, TI aims to scale its 300mm analog and embedded chip production to meet growing demand across sectors like automotive, industrial, and consumer electronics. The investment, bolstered by government incentives, positions TI as a central player in the U.S. semiconductor resurgence.
In parallel, researchers have demonstrated the world’s first functional CMOS computer using 2D materials MoS₂ and WSe₂ signaling potential long-term disruption to silicon-based architectures. Meanwhile, infrastructure components like diffusion cassettes are also gaining market attention, with projections pointing to a $2.1B market size by 2032 driven by fab automation, contamination control, and the transition to larger substrates. For senior engineers, these developments highlight critical areas for process innovation, material integration, and factory optimization in next-generation semiconductor design and manufacturing.
🇺🇸 Texas Instruments Commits $60B to U.S. Manufacturing
Texas Instruments will invest $60 billion to build or expand seven semiconductor fabs across Texas and Utah, calling it the largest foundational chip investment in U.S. history. The move will support 60,000 jobs and aims to boost domestic supply amid geopolitical pressure.
🏗️ TI’s Fab Expansion Plan in Detail
TI’s new Sherman, TX site will house four fabs (SM1–SM4), with initial production at SM1 starting this year. Facilities in Richardson, TX (RFAB2) and Lehi, UT (LFAB2) are also ramping. TI says its 300mm capacity will deliver analog and embedded chips at scale.
📉 Analyst Take: TI’s $60B Strategy
TI’s move aligns with reshoring goals outlined in the CHIPS Act. With $1.6B in government subsidies and up to $3B in loans, the company aims to reduce supply chain risk and meet long-term analog chip demand.
🧪 World's First 2D-Material Computer
Scientists have developed the first CMOS computer using 2D materials: MoS₂ (n-type) and WSe₂ (p-type). Though limited to 25 kHz, it demonstrates energy-efficient computing beyond silicon.
📦 Diffusion Cassette Market to Hit $2.1B by 2032
The global diffusion cassette market—key to wafer handling—will grow from $1.56B (2024) to $2.1B (2032) at a 3.76% CAGR. Demand is driven by 300mm wafer adoption, fab automation, and environmental standards. APAC leads in growth, followed by the U.S.
