Job Duties: Responsible for bringing the new product from tapeout to mass production.Design a characterization/testing plan and work with R&D teams and manufacturing engineers to resolve various technical issues to meet performance requirements. Participate in product definition and provide DFM inputs. Work in close collaboration with silicon foundry, imager characterization and pixel design. Interact with foundry fab in improving all silicon process, color, and package issues. Improve product yield and performance by process optimization and layout design update. Analyze yield and drive corrective actions for yield improvements. Drive characterization to finalize the product datasheet. Work with pixel design group to design the most sophisticated and optimized pixel layout. Work with characterization team to analyze and debug pixel device circuit and various image related issues. Ramp up for image sensors and ASIC devices. Coordinate with company's fab to drive semiconductor processing tool vendors to optimize processes, including raw material vendor, IMP tool vendor and photo resist vendor etc. Set up new tape out product process flows, inline handbooks, JDV check etc. Work with testing engineers to develop, verify and release testing program at CP or FT.
Requirements:
Master degree in Electrical Engineering, Physics or semiconductor related field and two (2) years of experience in process integration.
Must have the experience and skills in:
- Advanced semiconductor manufacturing processes and flows, including lithography, etching, CVD (Chemical Vapor Deposition), PVD (Physical Vapor Deposition), and CMP (Chemical Mechanical Polishing).
- Improving inline defect management, FA cross-section analysis, SPC (Statistical Process Control), WAT (Wafer Acceptance Testing) stability, and yield performance enhancement.
- Process tuning and side effect analysis for process modifications.
- Electrical testing and measurement techniques.
- Project management experience in failure analysis and root cause identification through the utilization of big data, trend charts, electrical and physical TEM (Transmission Electron Microscopy).
Annual base salary for this role in California, US is expected to be between $127,000 - $130,000. Actual pay will be determined on a number of factors such as relevant skills and experience, and the pay of employees in the similar role.