It's fun to work in a company where people truly BELIEVE in what they're doing!
We're committed to bringing passion and customer focus to the business.
If you like wild growth and working with happy, enthusiastic over-achievers, you'll enjoy your career with us!
Responsibilities:
- Responsible for Die Bond equipment process development, program optimization, parameter optimization, process capability improvement.
- Responsible for document preparation, review, modification, exception handling, report sorting and preparation.
- Responsible for new product review, process development and introduction to mass production.
- Maintenance and support for abnormal production line problems, including DB/WB Low Yield analysis and DOE experiment; Drive quality, yield, cost control and continuous improvement.
- Manage engineers and technicians in small teams.
Requirements:
- Bachelor’s degree or above, mechanical and electronic science and engineering major is preferred.
- 7 years or above packaging industry process work experience, familiar with Die Bond equipment and Die Bond process.
- team management experience is preferred, familiar with DOE, SPC, APQP, FMEA, failure analysis; Master 8D report.
- work seriously and responsible, with strong practical ability, good analysis and problem-solving ability.
- good English reading and writing, office software proficiency, have a good sense of quality.
We are an equal opportunity employer and value diversity at our company.
We do not discriminate on the basis of race, religion, color, national origin, sex, gender, gender expression, sexual orientation, age, marital status, veteran status, or disability status.
We will ensure that individuals with disabilities are provided reasonable accommodation to participate in the job application or interview process, to perform essential job functions, and to receive other benefits and privileges of employment.
Please contact us to request accommodation.