- Develop CMOS image sensor (CIS) using Technology Computer Aided Design (TCAD) modeling to predict optimal process condition and pixel design.
- Work with foundry partners to solve and improve process related issues for performance and yield.
- Benchmark simulation with silicon data, investigate any gap and provide solutions.
- Work with TCAD vendor on model calibration, capability enhancement, and efficiency.
- Analyze and interpret bench and wafer level data through numerical analysis tool.
- Design and manage silicon split lots with respect to project goals and schedules.
Requirements:
Master’s degree in Electrical Engineering, Physics, or related fields and three (3) years of experience in CIS process integration, including:
- Experience in Si based device technology (CMOS, CIS, etc)
- Semiconductor device physics and fabrication technologies.
- CIS process integration and product engineering.
- Advanced CIS pixel design.
- TCAD process and device simulation (Synopsys Sentaurus)
- Advanced TCAD tools modeling and calibration.
Annual base salary for this role in California, US is expected to be between $154,000 - $165,000. Actual pay will be determined on a number of factors such as relevant skills and experience, and the pay of employees in the similar role.